RAYTEX
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RAYTEX CORPORATION

1-33-3 Ochiai,Tama City, Tokyo, 206-0033 JAPAN
TEL: 042-338-2844@
FAX: 042-338-2846
e-mail: info@raytex.com
http://www.raytex.com
Business Description
Since its founding, our company has leveraged its unique marketing talents to provide high-precision wafer inspection metrology tools to the semiconductor industry, both in Japan and overseas, and enjoys a stellar reputation in its field.
One of the pillars of our business is our offering of in-house designed inspection tools. Raytex offers 3 equipment types: The EdgeScan system, for wafer apex scratch and roughness inspection; the BackScan, for wafer backside inspection, and the DynaSearch, for wafer topography measurement. These 3 tools form the backbone of the Raytex gWafer Exterior Shipping Inspection Lineh.
Raytexfs development team works around the clock to prepare solutions for tomorrowfs emerging needs.
The other pillar of our business is our offering of import metrology inspection tools.
In 1990 Raytex entered this market after obtaining rights of distributorship for sales of the MP2000 Pluslaser-type non-contact surface roughness metrology system (made by Chapman in the U.S.) to silicon wafer manufacturers. While supporting this tool in its climb to de-facto standard use in the industry for wafer apex roughness measurement, Raytex also opened new markets for its business partner, the Chapman Corporation.
Additional successes in this field include Raytexfs support in sales of wafer ID reader equipment made by the Acumen Corporation of America, bringing it from no-name status into de-facto standard use in the Japanese industry, in the short span of only 2 years.
In order to grow our business to meet the ever-expanding and ever-diversifying needs of the contemporary semiconductor market, with gautomationh as our byword Raytex aims to leverage the synergy effects of its participation in both the in-house developed and import tool businesses, to become the manufacturer of choice in Japan for semiconductor inspection equipment .
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