RAYTEX
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RAYTEX CORPORATION

1-33-3 Ochiai,Tama City, Tokyo, 206-0033 JAPAN
TEL: 042-338-2844@
FAX: 042-338-2846
e-mail: info@raytex.com
http://www.raytex.com
Company History
July 1988 Raytex Corporation established in Hachioji City, Tokyo with JPY 3M initial capital.
July 1990 Raytex begins sales of Chapman Non-Contact Surface Roughness Measurement Systems.
May 1993 Raytex begins sales of E + H Wafer Profile Measurement Systems.
Jan. 1994 Company headquarters moves to Kokubunji, Tokyo.
June 1995 Company headquarters moves to Tama City, Tokyo.
Dec. 1995 Raytex begins development of EdgeScan Wafer Edge Defect Automatic Inspection System.
May 1996 Raytex begins sales of EdgeScan Wafer Edge Defect Automatic Inspection System (first phase of in-house technology development).
March 1997 Raytex begins sales of Disk Surface Roughness Sensor (second phase of in-house technology development).
Oct. 1997 Company headquarters moved to present location.
Jan. 2001 Raytex concludes agreement with Seki Technotron, Inc. for comprehensive distributorship of Wafer Edge Defect Automatic Inspection System.
April 2001 Raytex begins sales of BackScan Wafer Backside Automatic Inspection System (third phase of in-house technology development)
July 2001 Raytex acquires distributorship rights to DynaSearch Wafer Topography Measurement Inspection System.
July 2002 Raytex begins in-house development of DynaSearch Wafer Topography Measurement Inspection System.
Jan. 2003 Raytex begins sales of Wafer Edge and Backside Combination Inspection System.
March 2003 Raytex opens Fukushima branch office in Fukushima City, Fukushima Prefecture.
June 2003 Raytex opens Fukuoka branch office in Fukuoka City, Fukuoka Prefecture.
July 2003 Raytex begins sales of Chapman Film Thickness Measurement System and Ion Dose Monitor.
Aug. 2003 Raytex USA Corporation established in Oregon, USA
Oct. 2003 Raytex announces Wafer Full-Surface Inspection System designed for intermediate processes (fourth phase of in-house technology development).
Oct. 2003 Raytex announces DynaSearch XP Wafer Topography Measurement Inspection System (in-house developed version).
April 22, 2004 Raytex Corporation listed on Tokyo Stock Exchange, Motherfs Market.
June 28, 2004 Raytex acquires patent and trademark rights to DynaSearch Wafer Topography Measurement Inspection System
Aug. 19, 2004 Raytex opens Taiwan branch office in Taipei, Taiwan.
Sept. 27, 2004 Raytex acquires patent and trademark rights to NanoPro NP1 Wafer Measurement Inspection System from KLA-Tencor Corporation.
Oct. 1, 2004 Raytex begins sales of EdgeScan Plus Wafer Edge Defect Inspection System.
Oct. 6, 2004 Raytex opens Korea branch office in Youngin City, Kyunggi-Do.
May, 2005 Commenced sales of Wafer Edge/Backside Multi-Function Inspection System
January 2006 Obtained ISO9001:2000 international certification of quality management system
May 2006 Commenced sales of NanoPro NP1 Wafer Inspection System
July 2006 New building construction completed in Tama Ochiai, Headquarters office relocated
March 2007 NanoSystem Solutions, Inc. added as wholly-owned subsidiary through share exchange
April 2007 Obtained patent and trademark rights to gWafer Internal Defect Inspection Systemh thought Mitsui Mining and Smelting Co., Ltd.
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