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| In-House Developed Equipment Products |
EdgeScan Wafer Edge Defect Automatic Inspection System
EdgeScan B+ Wafer Edge/Backside Combination Inspection System
DynaSearch XP Wafer Topography Measurement System
NanoPro NP2 Wafer Topography Measurement System
LSTD Scanner
BMD Analyzer
D-light DL-1000: Maskless Photolighography System
SWING ActiveX, SECS/GEM, HSMS Communication Control Software |
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| Import Products |
MP Series Non-Contact Surface Roughness Measurement System (Chapman/US)
MX Series Wafer Thickness, Sori and Warping Measurement System (E+H Co./Germany) |
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 SWiNG |
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| SWING2 industry-standard SECS-I/II/HSMS-compliant ActiveX communication control |
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