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| Wafer Backside Automatic Inspection System |
Automation of Backside Inspection
Visual Inspection Replacement Series, Phase 3 |
 Automate your visual inspections!
Automation of visual inspection has finally been achieved with the development of this product, the BackScan system.
Using a proprietary image judgment algorithm, wafer backside scratches, crystal defects, and particles can be detected and automatically judged based on individually-settable threshold values.
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| Automates wafer backside visual inspection using specialty optics system and proprietary algorithms.
High-Speed Parallel Processing Via Twin Inspection Engine
The BackScan features a twin inspection engine, enabling higher throughput through simultaneous inspection on two inspection stages. Instead of dedication per stage, idle CPU resources are identified and detection processing is sequentially shunted for maximum speed and efficiency.
Proprietary Inspection Algorithm
A three-layer processing method is used in the BackScan’s defect detection algorithms for more reliable inspection. Defects are first detected per individual screen, and judged based on size, brightness and shape. Next, images judged from each screen are collated to extract their linkage to defects, and scratch length is measured.
In addition, the entire image is re-processed to detect macro defects. Using this three-level processing method, judgment more closely reproduced that achieved in operator inspections.
・Detects short scratches within shots
・Detects macro defects extending over several shots
・Detects crystal pinholes via shape recognition algorithm
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Inspection Engine Features
Full-Edge Handling
Transfer Robot with Aligner
Defect Judgment Using Proprietary Algorithm
Image Inspection Via CCD Using Engine
High-Speed Parallel Processing Via Twin Engine |
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