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Non-Contact High-Resolution Surface Profile Measurement System
Backside Post-Polish Non-Contact Automatic Die Crack Inspection System |
●Non-Contact Surface Profiler
●Surface Roughness
●Backside Roughness
●Edge Roughness
●Backgrind Wafer Die Crack Inspection |
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■Outline
The Chapman MP2100 non-contact high-resolution surface profile measurement system
was designed not only for in-line quality management in disk manufacturing,
but also for use in research and development applications. The MP2100 exceeds
all previous systems in its use of a short green-light laser lightwave and
500nm sampling separation to achieve high resolution. Windows NT4.0 is used
as this system’s OS, lending flexibility to user programming and offline analysis
application. |
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■Features
・Non-Contact Measurement Using Laser
・Compatible with Disks and Wafers
・100mm Scan Length
・50nm Minimum Sampling Interval
・Wafer Front- and Backside can be Checked using Viewing System
・Multiple Scans with One Keystroke Operation Using Macro Function
・Enhanced Security Using Passwords
・98% or Higher Repeatability
・0.33μ Spatial Resolution
・Clear Glass Measurement Possible Using Latest Focus Function
・3D Function
・Disk Surface Circumferential Measurement Function
・Auto Focus Function
■Applications
・In-Line Wafer Die Crack Inspection
・Die Chip Inspection
・Circumferential and Radial Measurement
・Circumferential and Radial Waviness Measurement |
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| Detected die cracking can be checked on Viewing System Monitor |
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| Detected die chipping can be checked on Viewing System Monitor |
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■Outline
The Chapman MP3100 non-contact high-resolution surface profile measurement system was designed to meet the stringent requirements of the wafer manufacturing industry.
The MP3100 can accommodate both 200mm and 300mm wafer sizes.
Its cassette handling system, with multiple axes and options, make a fully automatic wafer measurement system possible. |
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■Features
・Non-Contact Measurement Using Laser
・Fully Automated Front- and Backside Measurement of Bevel, Apex, and Orientation Flat (Both Circumferential and Radial Directions for Each)
・100mm Scan Length
・4-Tier Password Protection Enhances Security (NT4.0)
・Automatic Bevel Angle Detection
・98% or Higher Repeatability
・Accommodates 200mm and 300mm Wafers
・Wafer Frontside can be Checked Using Viewing System
・Multiple Scans with One Keystroke Operation Using Macro Function
・S2 and CE |
■Applications
・Surface Roughness High-Precision Measurement
・Backside Roughness High-Precision Measurement
・Notch Roughness Measurement
・Wafer Notch Bottom Profile Measurement
・Edge Apex Radial Direction Measurement
・Edge Apex Circumferential One-Pass Measurement
・Edge Bevel Circumferential One-Pass Measurement
・Surface Waviness Measurement
・Backside Waviness Measurement
・Roll-Off High-Precision Measurement
・Scratch Analysis |
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