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| Flatness and Nanotopography Measurement System |
| 360-degree wafer roll-off measurement is possible |
Performs high-resolution high-accuracy wafer topography measurement using Raytex’s proprietary optical measurement system.
Minimal impact due to vibration or other equipment environmental conditions unavoidable using conventional interferometry.
Employs a stepper-type chuck for measurement to reproduce lithography flatness conditions in measurement.
Wafer Chuck Flatness Measurement is Possible
Using Raytex’s proprietary optical method, the DynaSearch performs scientific wafer topography measurement and inspection to quantify wafer flatness and topography.
This one unit handles both the wafer flatness and the nanotopography measurements necessary to evaluate wafer manufacturing quality. The Raytex’s EdgeScan edge inspection, BackScan backside inspection and flatness and topography measurement performed by the Raytex DynaSearch are a winning product combination that enables users to create a total shipping inspection line. |
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| Flatness Measurement |
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| 1:Raw Image 2:Height Map 3:SiteView 4:Site Graph 5:Site Flatness 6:Measurement Parameters and Summary Data |
| Nanotopography Measurement |
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| 1:Raw Image 2:Filtered Height Map 3:S-Curve and Cumulative Statistics 4:Filtered Height Map 5: P-V Distribution Map 6:NT Defect Map |
| Roll-off measurement |
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| Global Planalization |
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