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| Wafer Thickness, Sori and Warping Measurement System |
●Electrostatic Capacitance Type Thickness Measurement System
●Flatness Measurement
●Bow/Warp Measurement
●Process Wafer Sori Measurement |
300mm Silicon Wafer Profile Measurement System
(Manufactured by E + H Company, Germany)
■Equipment Outline
・300mm Wafer-Compatible Fully Automatic Measurement Inspection Tool
・Non-Contact Measurement Using Electrostatic Capacitance Sensor
・78 Wafers Per Hour Throughput
■Features
・300mm backgrinding of tape-laminated wafers using electrostatic capacitance sensor technology.
・ Non-contact fully automatic inspection system for wafer thickness and profile. |
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■Applications
・Backgrinding thickness polish process control for tape-laminated wafers
・ Backgrinding of tape-laminated wafers
・ Pre/Post wafer profile management; Post-polish wafer thickness and warp measurement
・ Thickness and warp measurement of wafers with films |
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■Features
Using 2 pairs of electrostatic capacitance sensors and lasers, this system is a non-contact fully-automatic inspection system that allows bare wafers at the wire sew (bare wafer) process stage, the first wafer process stage, to clear final wafer nanotopography specifications.
■Applications
・Wire sew wafer thickness, waviness, warping and roughness can be inspected and managed using just this all-in-one system. |
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