 |
|
|
| Wafer Edge Defect Automatic Inspection System |
|
 |
|
 Today, the move to larger-diameter 300mm wafers is progressing, and problems with wafer breakage have become much more apparent. Breakage of wafers while in process not only renders the wafer that was processed useless, but also, because the wafer has broken while inside the production equipment, can also lead to major downtime of the production equipment itself. Wafer edge defects are a leading cause of this type of wafer breakage.
Recently, one report after another has substantiated the role of chips, cracks and other defects at the wafer edge as causes of wafer breakage, brought about by heat stress in thermal processes such as RTP and by mechanical stress in the CMP process. In order to prevent in-process wafer breakage, 2 measures must be implemented by the manufacturer: (1) Minimization of wafer edge defects in the bare wafer supply, and (2) Promotion of edge defect prevention during processing.
The EdgeScan RXW-1200 Wafer Edge Inspection System is effective in both
raw wafer shipping inspection and in-process wafer edge inspection and
monitoring.
|
|
 |
|
| Laser scanning is used in inspection by this system, which achieves a high throughput at 180 wafers per hour (on 8-inch wafers), supporting users in enhancing productivity. |
| １． |
Edge Defect Inspection
・Chips and cracks
Post-Etch, Post-Polish, Pre-Shipment |
|
|
| ２． |
Roughness Inspection
・Across-the-Wafer Apex Roughness Inspection
・Wafer-to-Wafer Roughness Monitoring |
|
|
| ３． |
Device Wafer Inspection
・Detects Process Equipment-Induced Chips/Cracks,
Early Warning System for In-Process Wafer Breakage
・Detects Resist Residue-Induced Particles
・Detects Particles, Stains and Contamination
|
|
|
| ４． |
SOI Wafer Inspection
・Apex Defect Inspection
・Bonding Wafer Island Inspection
・Bonding Wafer SOI Exclusion Measurement
|
|
|
|
