RAYTEX CORPORATION 1-33-3 Ochiai,Tama City, Tokyo, 206-0033 JAPAN TEL: 042-338-2844　 FAX: 042-338-2846 e-mail: info@raytex.com http://www.raytex.com

Product Outline Features Process Flow RXM Series Wafer Edge and Backside Combination Inspection System Through a combination of the EdgeScan’s apex inspection and the BackScan’s backside inspection functionalities, the EdgeScan B+plus makes shipping inspection even more efficient, supporting users in reducing shipping costs and achieving stability. Consists of two stages, one for the Edge Inspection Unit and one for the Backside Inspection Unit. Just set the cassette on the load port and edge defects and backside defects for automatic inspection. Uses a full edge-handling method in both the Edge Inspection Unit and Backside Inspection Unit, to eliminate the need for contacting the wafer front or back surfaces. Edge Inspection Unit features Raytex’s latest edge inspection engine. Backside Inspection Unit features newly-developed optics system and specialty algorithms to enable image processing and high-sensitivity inspection.