 NThe NanoPro NP2 is a topography measurement system designed for application to the new generation of high-quality wafer.
Using a glancing incidence interference method, both sides of the wafer are measured simultaneously, and in an edge handling format the flatness, nanotopography and edge roll-off of both the front and back sides of the wafer are measured.
Even nanotopography measurement, in which the effects of chucking during measurement are a concern, is performed without contact with the wafer backside by the NanoPro NP1, to achieve both-side simultaneous measurement.
Through use of its glancing incidence interference method, the NanoPro NP1 fully accommodates the needs of Thin-SOI wafers as they move into ascendancy as the next generation of wafer.
This system also makes it possible to measure rough surfaces not possible to measure previously using conventional interferometers, and can perform high-resolution, high-accuracy measurement of 200mm SSP wafers.
Due to its ability to perform rough surface measurement and its wide dynamic range, which are features of its glancing incidence interference method, the NanoPro NP1 can measure wafers all the way from front-end process stages such as lapping and grinding to polished and post-Epi wafers. The NanoPro NP1 can contribute its strength throughout the wafer manufacturing process, to manage profile and processing amounts and enhance process yield.
Because it uses a full edge-handling method, use of the NanoPro NP1 eliminates the need for cleaning processes after pre-shipment measuring of DSP wafers.
The NanoPro NP2 also has a proven track record of use for 300mm and 200mm wafers.
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